CLAUSE CODE: QC122    This clause is current as of 12/03/2021; 08:41:38
  CLAUSE TITLE: Bare Die Requirements

QC122 - Bare Die Requirements:

General Requirements

For all devices provided in bare die form, the Subcontractor shall properly handle, package, and identify, as required in accordance with the latest revision of:

  • MIL-PRF-38535 General Specification for Integrated Circuits Manufacturing
Packaging Requirements

All Bare Die parts shall be packed with the following:

  • Static Shielding Moisture Barrier Bag
  • Desiccant (including gel)
  • Humidity Indicator
  • Identification Label “Bare Die”
  • Caution Label