QC122 - Bare Die Requirements:
General Requirements
For all devices provided in bare die form, the Subcontractor shall properly handle, package, and identify, as required in accordance with the latest revision of:
- MIL-PRF-38535 General Specification for Integrated Circuits Manufacturing
Packaging Requirements
All Bare Die parts shall be packed with the following:
- Static Shielding Moisture Barrier Bag
- Desiccant (including gel)
- Humidity Indicator
- Identification Label “Bare Die”
- Caution Label