QC123 - End Item Data Package - Deliverables to Accompany Printed Wiring Assembly (PWA):
In addition to the PWAs, the following must be included in the delivery:
(Ref. DocID 35120, Sec. 3.5, Para 4.3)
- Certificate of Compliance shall contain the following:
- JPL’s Subcontract/Purchase Order number
- Line item number from the JPL Subcontract/Purchase Order
- Part number and revision letter as identified in the Subcontract/Purchase Order
- Part description (title) of each item
- Quantity of each item
- Serial number, or if there is no serial number, screening lot number of each item
- Name and address of manufacturing or processing location
- Manufacturer’s date code, lot number, and/or logo, and/or serial number(s)
- Be signed and dated by Subcontractor representative
- All manufacturer reports/results. The PWA manufacturer shall include the items listed below
- If applicable, a complete list of the test results performed at the bareboard level or on the unpotted and potted harnesses
- A complete shortage list (parts and/or activities as applicable)
- A list of all problem/failure reports generated against any piece of equipment, including open and closed status
- Results of ionic contamination testing
- All deviation and waiver reports, including all MRB actions taken on the PWAs or constituent materials
- All raw material reports and vendor certifications, if any
The End Item Data Package (EIDP) shall comprise the following document:
- Completed Hardware Build Book
- All material certificates; the material used shall be traceable to the manufacturer’s lot number through date code and serial number.
- As-Built Configuration List (Parts lists)
- Assembly Documents
- Table of contents
- Log sheets to record work travelers and non-conformance reports
- Work Travelers
- Deviations from Drawing and parts lists and objective evidence for the approval
- Copies of all redlined drawings and parts lists
- Copies of all Non-Conformance reports
- Rework documentation
- ESD Logs (soldering irons grounding and stray voltage)
- Soldering Iron Temperature Logs
- List of Indirect Assembly Materials (solder, ink, wire, flux, etc.) including lot and expiration date
- X-Ray Images of CGA, BGA and BTC components
- Surface Mount Process Paste Height (mean & std dev)
- Surface Mount Process Reflow Profile
- High resolution photo documentation of all sides of the completed PWA
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